OSSO pending adjustments (batch)
Logged changes to apply together in the next design batch.
- [x] ~~2026-10-20 8:18 AM ET — Companion lap pads: via-in-pad (plated ~Ø0.4–0.6) through each companion lap pad, small exposed ENIG ring on companion top for visual solder-flow check; add extra paste to offset wicking. Also vents flux/gas and allows iron touch-up through the via.~~ SUPERSEDED / N/A for top v1i (2026-10-20): the top-board companion lap pads were removed in v1i (card-edge connectors instead). Not applied anywhere. Still potentially applicable to the base v3b companion lap pads; carry forward if the base companions are kept.
- [x] 2026-10-20 8:30 AM ET — Top board (v1h): remove the TH grid holes in the lower-centre block, i.e. the two grid columns-groups either side of the lower spine corridor (SMT-2B), from just above the 5mm strip up to about the bottom of the pogo-block region, roughly x 50–90 (the designer red box, see refs/adjustments/2026-10-20_top_v1h_lower_center_SMT.png). Convert to NO-TH SMT zone (solid pour). Exact bounds to confirm in batch. DONE in top v1i (2026-10-20): SMT-4 NO-TH pour x 51.0–89.0, y 12.0–44.14 (merges SMT-2B); 144 grid holes removed (cols x 52.22–64.92 and 75.08–87.78, rows y 14.12–42.06). See drawings/osso_top_v1i.png note 11.
- [ ] 2026-10-20 8:34 AM ET — FUTURE TO-DO (not current batch): DIY mini wave/dip solder pot + masking carrier for the blanks. Concept v1 being drafted for reference only.
- [ ] 2026-10-20 8:35 AM ET — FUTURE TO-DO: consider a specialized reflow tool optimized for the standardized 140x140 blanks (and companions), e.g. sized hot plate/oven fixture.
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[ ] 2026-10-20 8:39 AM ET — FUTURE TO-DO: consider a specialized pick-and-place designed for the spec-to-build concept (one-offs, low volume/high mix) and sized to the standardized 140x140 boards and companions.
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[ ] (queued 2026-10-20 9:41 AM ET, the designer) Top board: extend the three via columns in the middle of the board (lower spine) down to the 5mm terminal strip. Not applied in v1i/v8; do in next batch.
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[ ] (queued 2026-10-20 9:44 AM ET, the designer) Blanks: pre-cleared annulus around each TH pad with 3–4 pre-made copper bridges to the pour. Isolating a pad = laser cuts the bridges only; grounded pads keep bridges as thermal relief. Goal: less etching and fewer etching errors. Consider for next version; not applied.
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[ ] (queued 2026-10-20 9:58 AM ET, the designer) Card-edge companion boards (2×10, 2×22, all future): add corner mounting drills for mechanical stabilization to any enclosure designed. Future iterations; not applied.
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[ ] (queued 2026-10-20 12:29 PM ET, the designer) Design the drum-frame stencil holder (PETG, inner/outer ring tensioning, pin registration to the board jig datum, covers the 140 mm board + margin). Plus a laser test: polyimide cut power/speed sweep.
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Stencil v2 drawing/README: change the sequence to cut the film with no board, then insert the PCB and lift (decided Oct 20, 2026). Update the note that says 'cut with the carrier lowered' with the board in place.